Electro-Plating: Surface coating of High Temperature Superconductors with Cu and Cu alloys*

2^nd generation coated conductor

Object: Finishing the HTS materials (contacting, joining, surface sealing) for the dedicated functionality 20 micrometer Cu are deposited by the galvanic process on the surface. Copper possess a unique central position within all the new HTS.

Coated Conductor (CC) tape with Cu shunt

Prototype Reel - to - reel Cu pulse - electroplating facility

ATZ developed, designed and fabricated a prototype copper pulse electroplating facility for continuous coated conductor (CC) Cu deposition^*. The delivered facility is now tested within a CC fabrication line.

Features, advantages

• shunt function
• Improved conductor current and voltage stability
• Mechanical stabilization
• Easy joint and contact fabrication
• Solder ability
• Better thermal coupling
• Multi – layer function
• Conductor surface masking

Prototype Reel - to - reel Cu pulse - electroplating facility

* Patents:

EP 1313895

DE 199 64 478.0-45, 13902814 (Appl.)