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Electro-Plating: Surface coating of High Temperature Superconductors with Cu and Cu alloys*

Object: Finishing the HTS materials (contacting, joining, surface sealing) for the dedicated functionality.Few micrometer Cu are deposited by the galvanic process on the surface. Copper possess a unique central position within all the new HTS.

Coated Conductor (CC) tape with Cu shunt

Prototype Reel - to - reel Cu pulse - electroplating facility

ATZ developed, designed and fabricated a prototype copper pulse electroplating facility for continuous coated conductor (cc) Cu deposition*. The delivered facility is now tested at a cc fabrication line.

Features, advantages

  • shunt function
  • Improved conductor current and voltage stability
  • Mechanical stabilization
  • Easy joint and contact fabrication
  • Solder ability
  • Better thermal coupling
  • Multi – layer function
  • Conductor surface masking

* Patents:

US 7,048,840

EP 1313895

DE 199 64 478.0-45, 13902814 (Appl.)

Prototype Reel - to - reel Cu pulse - electroplating facility